Over the past few days, multiple instances have surfaced of a rumour that Qualcomm is working on the Snapdragon 1000. ArsTechnica has reported information from a Germany-based site that the 12w chip will likely be as powerful as an ultra-low voltage 2017 core Intel processor.
The Germany-based site drew inference from a job description posted, seeking an engineer to test Qualcomm ‘SDM845 and SDM1000’ chips. This could mean that Qualcomm is looking far beyond its Snapdragon 850 which is already in-line with Intel Y-Series chips.
Qualcomm’s Snapdragon 850 is supposed to be out at the end of this year, so it’s unlikely that the 1000 will see light of day so soon. Given that the 1000 also has a larger footprint that other Snapdragon chips, it is most likely bound for laptop-type devices.
The leaked information comes almost at the same times that Qualcomm announced three new Snapdragon chips meant for high and mid-tier devices. The Snapdragon 632, 439 and 429 chips are more powerful and boast better graphic performance, plus integrate artificial intelligence (AI) capabilities into the highest-selling Snapdragon tiers.
More on the Snapdragon 632, 439 and 429
The new Snapdragon 632 brings some of the most sought-after mobile experiences, including mainstream gaming, 4K video capture, artificial intelligence, and fast LTE speeds—all for an affordable price.
It’s built on advanced FinFET process technology, offering up to 40% higher performance due to the combination of the Qualcomm Kryo 250 CPU and Qualcomm Adreno 506 GPU. The 632 also includes the X9 LTE modem, which supports LTE Advanced technologies like carrier aggregation.
The Snapdragon 439 and 429 were designed for mass-market consumption, yet still offer AI capabilities that enhance the camera, voice, and security experience. They both feature the established X6 LTE modem for fast downloads and smoother video streams.
The Snapdragon 429 scales to an Adreno 504 GPU, for up to a whopping 50% improvement in graphics rendering. It also includes 16MP single-camera and 8+8MP dual-cameras with HD+ display.
Devices based on these three Snapdragon chips are expected out soon, in H2 of this year.